Blister packaging and sealing machine
HMI Blister packaging and sealing machine
Tray stock
separating station blisters
Chute for syringes
Supply station for needles
Pressing of the products in the blister
placing the lid on the blister
Seal station
outfeed products with reject
Outfeed of the products

Blister packaging and sealing machine

Tom Brouwers

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  • Label:Handling, processing, assembling, serialisation
  • Client:Big international medical company
  • Problem:Professionalize the packaging of syringes for medium amounts
  • Objective:Develop a fully automated packaging machine with a small footprint


For a customer in the medical industry, we designed and built a blister packaging and sealing machine, based on our LAP-C platform. Of course, the customers process and wishes were incorporated into the design. The LAP-C consists of six stations, with an extremely precise turntable moving the molds. Each station allows for a quadruple mold to be filled and processed simultaneously.

Station 1: The blisters are automatically placed from a repository into the quadruple mold.

Station 2: The syringes are manually placed in a chute and then automatically placed into the blister. Of course, it is possible to eliminate the manual activity by using an automated solution (for a larger buffer).

Station 3: The needles (in safety packaging) are separated in a vibratory filler and correctly orientated. The needles are then placed in the blisters two at a time. The needles and the syringe are pushed into the blister with a defined force.

Station 4: The presence of the products is checked with an optical system. This system also checks whether all components of the syringe are present. A Tyvek lid is then separated and placed. Finally, the correct placement of the lid is checked.

Station 5: The blister is sealed within the agreed seal window.

Station 6: If a product does not pass the visual inspection, or if it does not meet the preset seal window, it is rejected at this point. Approved products are exported.

This machine has a Siemens control. The LAP-C platform is suitable for various processes and has a small footprint. By using docking stations, we are able to guarantee accessibility of the platform.

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